Flexible phase change composite films with improved thermal conductivity and superb thermal reliability for electronic chip thermal management
Yanqi Ma, Huichang Wang, Li Zhang, Xinxin Sheng, Ying Chen
Topics & Concepts
Thermal conductivityThermal management of electronic devices and systemsMaterials scienceComposite numberThermalReliability (semiconductor)ChipPhase changeComposite materialPhase (matter)Computer scienceMechanical engineeringEngineering physicsThermodynamicsEngineeringTelecommunicationsPhysicsPower (physics)Quantum mechanicsPhase Change Materials ResearchThermal properties of materialsAdvanced Thermoelectric Materials and Devices