A study on the viscosity reduction mechanism of high-filled silicone potting adhesive by the formation of Al<sub>2</sub>O<sub>3</sub> clusters
Jing Wang, Haihong Ma, Fengmei Ren, Zhengfa Zhou, Weibing Xu
Abstract
Ω cm, respectively. A new strategy for preparing electronic potting materials with high thermal conductivity, good flowability and low CLTE is presented.
Topics & Concepts
PottingAdhesiveSiliconeViscosityMaterials scienceMechanism (biology)Reduction (mathematics)Composite materialPropellantChemical engineeringChemistryOrganic chemistryPhysicsMathematicsEngineeringGeometryLayer (electronics)Quantum mechanicsThermal properties of materialsSynthesis and properties of polymersFlame retardant materials and properties