Effect of bonding process on the microstructures and strength of W/steel joints with a W-Cu-Ni interlayer
Zonghui Yang, Xu Zhang, Jialin Cheng, Xiaoquan Li, Yifu Shen
Topics & Concepts
Materials scienceMicrostructureMetallurgyBonding strengthProcess (computing)Composite materialComputer scienceOperating systemAdvanced materials and compositesFusion materials and technologiesMetal and Thin Film Mechanics