Mechanical strengthening of nanotwinned Cu films with Ag solid solution
Kang-Ping Lee, Dinh-Phuc Tran, Fu-Chian Chen, Wei-You Hsu, Yi-Quan Lin, Hung-Che Liu, Chih Chen
Topics & Concepts
Materials scienceAnnealing (glass)CopperGrain boundarySolid solutionSolid solution strengtheningStrengthening mechanisms of materialsMechanical strengthMetallurgyThin filmLayer (electronics)Composite materialGrain sizeNanotechnologyMicrostructureMicrostructure and mechanical propertiesMetal and Thin Film MechanicsAluminum Alloys Composites Properties