Synergy between dodecylbenzenesulfonic acid and isomeric alcohol polyoxyethylene ether for nano-scale scratch reduction in copper chemical mechanical polishing
Chong Luo, Yi Xu, Nengyuan Zeng, Tengda Ma, Chenwei Wang, Yuling Liu
Topics & Concepts
ScratchChemical-mechanical planarizationPolishingCopperTribologyMaterials scienceScanning electron microscopeParticle (ecology)Nano-Particle sizeChemical engineeringComposite materialMetallurgyEngineeringGeologyOceanographyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research