1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening

Yi Zhao, Zhao-Yun Wang, Lei Jin, Jiaqiang Yang, Tao Song, Fang‐Zu Yang, Dongping Zhan, Dongping Zhan

2024Colloids and Surfaces A Physicochemical and Engineering Aspects11 citationsDOI

Topics & Concepts

Void (composites)Conformal mapMaterials scienceThickeningChlorideComposite materialMetallurgyGeometryPolymer scienceMathematicsElectrodeposition and Electroless CoatingsIonic liquids properties and applicationsCorrosion Behavior and Inhibition