A hierarchically encapsulated phase-change film with multi-stage heat management properties and conformable self-interfacing contacts for enhanced interface heat dissipation
Qing Lu, Xiang Wang, Xiang Wang, Hongwei Zhao, Xun-rui Wang, Xun-rui Wang, Jiaqing Zhao, Haoran Kong, Tao Wang, Chao Liang, Jinhong Li, Wayne Qiang Xu
Abstract
A novel hierarchically encapsulated phase change thermal interface material (PhC-TIM) is reported that can guarantee efficient temperature control of electronic devices.
Topics & Concepts
Conformable matrixInterfacingThermal management of electronic devices and systemsDissipationInterface (matter)Materials sciencePhase changeNanotechnologyMechanical engineeringComputer scienceEngineering physicsComposite materialEngineeringPhysicsThermodynamicsComputer hardwareCapillary numberCapillary actionPhase Change Materials ResearchThermal properties of materialsAdvanced Thermoelectric Materials and Devices