Effect of Cu(I) on electrochemical behavior and surface morphology of electrodeposited copper for different accelerators
Jing Xiang, Ziwei Qin, Yonggang Xu, Chong Zeng, Wenyao Yang, Liangliang Tian, Haibo Ruan
Topics & Concepts
CopperElectroplatingElectrochemistryCyclic voltammetryAnodeCathodeMaterials scienceCopper platingMorphology (biology)Chemical engineeringElectrodeChemistryMetallurgyComposite materialPhysical chemistryLayer (electronics)EngineeringGeneticsBiologyElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionConducting polymers and applications