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An optimized Ni P seed layer coating method for through glass via (TGV)

Yuzhe Chen, Jihua Zhang, Libin Gao, Siyue Zou, Kexin Liang, Zhongzhe Liu, Zhen Fang, Hongwei Chen, Qinyan Ye

2022Microelectronic Engineering13 citationsDOI

Topics & Concepts

Materials scienceElectroplatingAnnealing (glass)Layer (electronics)InterconnectionHydrofluoric acidCopperNIPNickelEtching (microfabrication)Copper platingPlating (geology)Composite materialChemical-mechanical planarizationMetallurgyGeophysicsComputer scienceGeologyComputer networkElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering Technologies3D IC and TSV technologies
An optimized Ni P seed layer coating method for through glass via (TGV) | Litcius