Low‐Temperature Processible Highly Conducting Pastes for Printed Electronics Applications
Vitalij Scenev, Jerzy Szałapak, Lukas Werft, Ole Hoelck, Małgorzata Jakubowska, Malte von Krshiwoblozki, Christine Kallmayer, Martin Schneider‐Ramelow
Abstract
Scalable additive manufacturing of printed electronics is a growing field accompanied by increasing demands for reliable and integrable functional flexible printed electronic devices. Herein, a novel type of electrically conducting silver‐based pastes for additive manufacturing is demonstrated. These pastes are designed for stencil‐ and screen‐printing and can be post‐processed at very low temperatures, at ambient. Furthermore, printed lines made with the pastes exhibit an electrical sheet resistance below 60 mΩ sq −1 even after room temperature and only 25 mΩ sq −1 after two minutes of curing at 90 °C.