Combined fluid flow simulation with electrochemical measurement for mechanism investigation of high-rate Cu pattern electroplating
Qing Wang, Zhe Wang, Yongtong Wang, Yao Tong, Mingxiang Chen
Topics & Concepts
ElectroplatingNucleationElectrolyteMaterials sciencePolarization (electrochemistry)Plating (geology)Current densityChemical engineeringElectrochemistryForced convectionAdsorptionChemical physicsConvectionComposite materialChemistryElectrodeThermodynamicsLayer (electronics)Physical chemistryOrganic chemistryGeologyPhysicsGeophysicsQuantum mechanicsEngineeringElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability