Fabrication and integration of functional stretchable circuit based on liquid metal
Xudong Pan, Hu He
Abstract
Abstract A liquid metal patterning method and a fabrication process for liquid metal stretchable circuits are described. The initial resistance of the wire-electrode unit is only about 1.4 Ω, and the maximum applied strain is up to 260%. Static stretching and dynamic fatigue tests both reflect the excellent resistance stability. Two types of integrated packaging processes for liquid metal stretchable circuits, surface mount and embedded, are presented. The LED-wire unit manufactured by the embedded method can work normally under a strain of 260%. Through the integration process of surface mounting, the electronic devices are integrated onto the flexible substrate, and the flexible circuit system demonstration of a flash LED is realized. The circuit can work normally under 100% strain. The integration process for liquid metal based flexible electronics provides potential applications in flexible micro-systems.