Mathematical modeling and test verification of viscoelastic materials considering microstructures and ambient temperature influence
Yeshou Xu, Zhao‐Dong Xu, Ying‐Qing Guo, Hongbing Jia, Xing‐Huai Huang, Yanwei Wen
Abstract
Micro structures of viscoelastic materials (VEM) play an important role in their mechanical properties and energy dissipation capacities. This work shows a mathematical modeling of VEMs considering molecular chain-network configurations, and the temperature effects on mechanical properties of VEMs can also be characterized based on the equivalent relationship between temperature and frequency. The Dynamic Thermomechanical Analyzer (DMA) test is carried out to observe dynamic behaviors of the VEM and prove the accuracy of the proposed new mathematical model. The experimental data of viscoelastic damper (VED) are utilized to further verify the correctness of the proposed model with different ambient temperatures.