Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders
Jinqing Xiao, Fuliang Wang, Junhui Li, Zhuo Chen
Topics & Concepts
Isothermal processMaterials scienceWettingIntermetallicDiffusionLayer (electronics)SolderabilityComposite materialSolderingDiffusion barrierCrystallinityMetallurgyChemical engineeringAlloyThermodynamicsPhysicsEngineeringElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless Coatings3D IC and TSV technologies