Reducing free formaldehyde emission, improvement of thickness swelling and increasing storage stability of novel medium density fiberboard by urea-formaldehyde adhesive modified by phenol derivatives
Peyman Pouresmaeel Selakjani, Ali Dorieh, A. Pizzi, Mohammad Hassan Shahavi, Amir Hasankhah, Sara Shekarsaraee, Marzieh Ashouri, Sogand Ghafari Movahed, Mohadese Niksefat Abatari
Topics & Concepts
FiberboardFormaldehydeAdhesiveMaterials scienceSwellingUrea-formaldehydeComposite materialMedium density fiberboardAbsorption of waterPhenolPhenol formaldehyde resinUreaPolymerChemical engineeringOrganic chemistryChemistryLayer (electronics)EngineeringDyeing and Modifying Textile FibersLignin and Wood ChemistryPhotopolymerization techniques and applications