Investigation of in-situ mechanical and chemical etching: A milder hydrometallurgical approach for Au, Ni, and Cu recovery from printed circuit boards
Danny Haonan Huang, Amanda Whai Shin Ooi, Aaron Moment
Topics & Concepts
In situPrinted circuit boardMaterials scienceMetallurgyEtching (microfabrication)Composite materialChemistryEngineeringElectrical engineeringOrganic chemistryLayer (electronics)Recycling and Waste Management TechniquesExtraction and Separation ProcessesElectron and X-Ray Spectroscopy Techniques