Analyses on the large size PBGA packaging reliability under random vibrations for space applications
Yeong K. Kim, Seok-min Lee, Do‐Soon Hwang, Seohyun Jang
Topics & Concepts
Random vibrationBall grid arrayPrinted circuit boardVibrationDrop testStructural engineeringChipMaterials scienceDrop impactStress (linguistics)SolderingElectronic engineeringEngineeringComposite materialAcousticsElectrical engineeringPhysicsWettingPhilosophyLinguisticsElectronic Packaging and Soldering TechnologiesMaterial Properties and ProcessingStructural Analysis and Optimization