Interface microstructure evolution and bonding mechanism during vacuum hot pressing bonding of 2A12 aluminum alloy
Dazhao Xu, Linggang Meng, Changri Zhang, Xi Chen, Xingguo Zhang
Topics & Concepts
Materials scienceMicrostructureDiffusion bondingRecrystallization (geology)Electron backscatter diffractionGrain boundaryThermocompression bondingAlloyAccumulative roll bondingComposite materialScanning electron microscopeDynamic recrystallizationTransmission electron microscopyAnodic bondingMetallurgyLayer (electronics)NanotechnologyHot workingBiologyPaleontologyAluminum Alloy Microstructure PropertiesAluminum Alloys Composites PropertiesMicrostructure and mechanical properties