FEA study on the TSV copper filling influenced by the additives and electroplating process
Zifeng Zhao, Ziyu Liu, Lin Chen, Qingqing Sun, Hongye Liu, Yabin Sun
Topics & Concepts
ElectroplatingThrough-silicon viaPlating (geology)Materials scienceFinite element methodCurrent densitySiliconCopper platingReliability (semiconductor)Process (computing)CopperComposite materialWork (physics)MetallurgyMechanical engineeringLayer (electronics)Structural engineeringComputer scienceEngineeringGeophysicsOperating systemPower (physics)PhysicsQuantum mechanicsGeology3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesElectrodeposition and Electroless Coatings