Laser slicing of a diamond at the {100} plane using an irradiation sequence that restricts crack propagation along the {111} plane
Kosuke Sakamoto, Daijiro Tokunaga, Sho Itoh, Hirofumi Hidai, Souta Matsusaka, Takashige Omatsu, Koji Koyama, Seongwoo Kim, Noboru Morita
Topics & Concepts
SlicingDiamondWaferMaterials scienceLaserPlane (geometry)OpticsComposite materialOptoelectronicsGeometryPhysicsMechanical engineeringEngineeringMathematicsDiamond and Carbon-based Materials ResearchAdvanced Surface Polishing TechniquesLaser Material Processing Techniques