Litcius/Paper detail

Enhanced solder fatigue life of chip resistor by optimizing solder shape

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park

2023Microelectronics Reliability11 citationsDOI

Topics & Concepts

SolderingResistorThermal shockMaterials scienceChipStencilSolder pastePrinted circuit boardJoint (building)Reliability (semiconductor)Composite materialTemperature cyclingReflow solderingShock (circulatory)Structural engineeringThermalElectrical engineeringEngineeringComputer sciencePower (physics)Quantum mechanicsMeteorologyMedicineComputational scienceVoltageInternal medicinePhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMechanical Behavior of Composites
Enhanced solder fatigue life of chip resistor by optimizing solder shape | Litcius