Litcius/Paper detail

Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire

Yue Chen, Zhongwei Hu, Yiqing Yu, Zhiyuan Lai, Jiegang Zhu, Xipeng Xu, Qing Peng

2022Materials Science in Semiconductor Processing76 citationsDOIOpen Access PDF

Topics & Concepts

Materials scienceMachiningGrindingSapphireBrittlenessSurface roughnessVibrationSurface finishMechanical engineeringComposite materialSurface integrityAerospaceMetallurgyOpticsAcousticsLaserPolitical sciencePhysicsEngineeringLawAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques