Synergistic effect of aminosilane and K2CO3 on improving Chemical Mechanical Polishing performance of SiO2 dielectric layer
Qun Zhao, Shunfan Xie, Hanxiao Wang, Luyao Yang, Xukun Mei, Yangang He
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceAbrasiveZeta potentialSlurryPolishingChemical engineeringX-ray photoelectron spectroscopySurface roughnessSurface modificationDielectricFourier transform infrared spectroscopyLayer (electronics)Particle sizeAdsorptionParticle (ecology)Composite materialNanotechnologyNanoparticleOrganic chemistryChemistryOptoelectronicsGeologyOceanographyEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization