Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Chien-Lung Liang, Yung‐Sheng Lin, Chin-Li Kao, David Tarng, Shan-Bo Wang, Yun-Ching Hung, Gao-Tian Lin, Kwang‐Lung Lin
Topics & Concepts
ElectromigrationMaterials scienceJoule heatingCurrent densityMicrostructureCurrent crowdingDielectricComposite materialJoule effectOptoelectronicsQuantum mechanicsPhysicsCopper Interconnects and ReliabilityElectronic Packaging and Soldering Technologies3D IC and TSV technologies