A high-entropy alloy as very low melting point solder for advanced electronic packaging
Yingxia Liu, Pu Li, Yong Yang, Quanfeng He, Ziqing Zhou, Chengwen Tan, Xiuchen Zhao, Q. Zhang, K. N. Tu
Abstract
SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.
Topics & Concepts
IntermetallicSolderingAlloyMaterials scienceMelting pointWettingElectronic packagingMetallurgyHigh entropy alloysActivation energyReflow solderingComposite materialChemistryPhysical chemistryHigh Entropy Alloys StudiesHigh-Temperature Coating BehaviorsIntermetallics and Advanced Alloy Properties