High-Thermal-Conductivity Graphene/Epoxy Resin Composites: A Review of Reinforcement Mechanisms, Structural Regulation and Application Challenges
Hong-Wei Yang, Zongyi Deng, Minxian Shi, Zhixiong Huang
Abstract
As electronic devices advance toward higher power density, heat dissipation has emerged as a critical bottleneck limiting their reliability. Graphene oxide (GO)/epoxy resin (EP) composites, combining high-thermal-conductivity potential with polymer-matrix advantages, have become a key focus for overcoming the limitations of traditional metal heat-dissipation materials. This review systematically examines these composites, analyzing their thermal conductivity enhancement mechanisms, structural regulation strategies, and application challenges. We first elaborate on how GO's intrinsic properties influence its enhancement capability, then explore the roles of physical dispersion strategies and interfacial modification techniques in optimizing filler dispersion and reducing interfacial thermal resistance, revealing the effects of preparation processes on thermal conduction network construction. Their remarkable potential is demonstrated in applications such as electronic packaging and electromagnetic shielding. However, challenges including cross-scale structural design and multi-physics collaborative regulation remain. This review aims to provide theoretical foundations and technical guidance for transitioning these composites from lab research to industrial application and advancing thermal management in high-performance electronics.