Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate
Manoj Kumar Pal, Gréta Gergely, Dániel Koncz‐Horváth, Zoltán Gácsi
Topics & Concepts
Materials scienceMicrostructureSolderingIntermetallicWettingMetallurgyNucleationComposite materialSilicon carbideLayer (electronics)AlloyOrganic chemistryChemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties