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A novel adaptive slicing algorithm based on ameliorative area ratio and accurate cusp height for 3D printing

Yifei Hu, Xin Jiang, Guanying Huo, Cheng Su, Hexiong Li, Zhiming Zheng

2021Rapid Prototyping Journal22 citationsDOI

Abstract

Purpose Adaptive slicing is a key step in three-dimensional (3D) printing as it is closely related to the building time and the surface quality. This study aims to develop a novel adaptive slicing method based on ameliorative area ratio and accurate cusp height for 3D printing using stereolithography (STL) models. Design/methodology/approach The proposed method consists of two stages. In the first stage, the STL model is sliced with constant layer thickness, where an improved algorithm for generating active triangular patches, the list is developed to preprocess the model faster. In the second stage, the model is first divided into several blocks according to the number of contours, then an axis-aligned bounding box-based contour matching algorithm and a polygons intersection algorithm are given to compare the geometric information between several successive layers, which will determine whether these layers can be merged to one. Findings Several benchmarks are applied to verify this new method. Developed method has also been compared with the uniform slicing method and two existing adaptive slicing methods to demonstrate its effectiveness in slicing. Originality/value Compared with other methods, the method leads to fewer layers whilst keeping the geometric error within a given threshold. It demonstrates that the proposed slicing method can reach a trade-off between the building time and the surface quality.

Topics & Concepts

SlicingStereolithographyComputer scienceMinimum bounding boxAlgorithm3D printingIntersection (aeronautics)Matching (statistics)MathematicsComputer visionComputer graphics (images)Mechanical engineeringEngineeringStatisticsAerospace engineeringImage (mathematics)Additive Manufacturing and 3D Printing Technologies3D Shape Modeling and AnalysisAdditive Manufacturing Materials and Processes
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