Microstructural evolution of Cu/W nano-multilayers filler metal during thermal treatment
Hong Li, Zeng-cheng Xing, Bo-jin Li, Xusheng Liu, Benjamin Lehmert, M. Manka, Zhuoxin Li, Wolfgang Tillmann
Topics & Concepts
Materials scienceCopperAnnealing (glass)TungstenNano-Melting pointThermal stabilitySputter depositionMetalMetallurgyComposite materialSputteringChemical engineeringThin filmNanotechnologyEngineeringAdvanced materials and compositesHigh-Temperature Coating Behaviorsnanoparticles nucleation surface interactions