Litcius/Paper detail

Cryogenic and ultrasonic-assisted micro-drilling of printed circuit boards using high-frequency-amplitude spindle

Moran Xu, Shuo Chen, Rendi Kurniawan, Changping Li, Saood Ali, Sijia Liu, Hanwei Teng, Pil Wan Han, Tae Jo Ko

2024Journal of Manufacturing Processes17 citationsDOI

Topics & Concepts

DrillingMaterials scienceMachiningUltrasonic sensorTool wearUltrasonic machiningDrillVibrationMechanical engineeringAcousticsMetallurgyEngineeringPhysicsAdvanced machining processes and optimizationAdvanced Machining and Optimization TechniquesAdvanced Surface Polishing Techniques
Cryogenic and ultrasonic-assisted micro-drilling of printed circuit boards using high-frequency-amplitude spindle | Litcius