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Influence of welding parameters and surface preparation on thin copper–copper sheets welded by ultrasonic welding process

Rafael Gomes Nunes Silva, Koen Faes, Sylvia De Meester, Wim De Waele, Andrzej Kubit

2022The International Journal of Advanced Manufacturing Technology30 citationsDOIOpen Access PDF

Abstract

Abstract Ultrasonic welding is increasingly used in industry. In this paper, the influence of ultrasonic welding parameters (USW) on the joint strength and quality was analysed. The properties of the USW joints depend on many factors. The work focuses on the influence of the technological parameters and the surface properties of welded EN Cu-ETP copper sheets with a thickness of 1 mm. The impact of the process parameters, such as welding time, pressure, vibration amplitude and the surface roughness on the lap shear strength and the metallographic weld properties was analysed. The welding energy for each variant was also determined. The research was conducted on the basis of a full factorial design of experiments. The optimal process parameters were determined to obtain high-quality joints in terms of strength and weld quality. Based on the presented experimental study, it was demonstrated that the ultrasonic vibration amplitude has the greatest impact on the joint strength. A surface preparation with acetone resulted in the highest tensile strength and welding energy and, making any additional surface treatment prior to welding unnecessary.

Topics & Concepts

WeldingMaterials scienceUltrasonic weldingElectric resistance weldingSurface roughnessUltimate tensile strengthComposite materialJoint (building)Plastic weldingMetallurgyCopperCold weldingHeat-affected zoneVibrationUltrasonic sensorGas metal arc weldingStructural engineeringArc weldingFiller metalEngineeringAcousticsPhysicsAdvanced Welding Techniques AnalysisWelding Techniques and Residual StressesAluminum Alloys Composites Properties
Influence of welding parameters and surface preparation on thin copper–copper sheets welded by ultrasonic welding process | Litcius