A Detailed Thermal Resistance Network Analysis of FCBGA Package
Hao Dang, Yang Lu, Yanzheng Du, Xiu Zhang, Qian Zhang, Weigang Ma, Xing Zhang
Topics & Concepts
Thermal resistanceBall grid arrayMaterials scienceThermal conductionThermalInterfacial thermal resistanceWork (physics)Thermal conductivityField (mathematics)MechanicsThermodynamicsComposite materialPhysicsMathematicsPure mathematicsSolderingThermal properties of materials3D IC and TSV technologiesSilicon Carbide Semiconductor Technologies