Monolithic 3D integration as a pathway to energy-efficient computing and beyond: From materials and devices to architectures and chips

Yijia Fan, Ran An, Jianshi Tang, Yijun Li, Ting Liu, Bin Gao, He Qian, Huaqiang Wu

2024Current Opinion in Solid State and Materials Science14 citationsDOI

Topics & Concepts

Computer scienceComputer architectureNanotechnologyEmbedded systemDistributed computingMaterials scienceAdvanced Memory and Neural ComputingSemiconductor materials and devices3D IC and TSV technologies