Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging

Limin Ma, Yuchen Wang, Qiang Jia, Hongqiang Zhang, Yishu Wang, Dan Li, Guisheng Zou, Fu Guo

2023Journal of Electronic Materials13 citationsDOI

Topics & Concepts

SinteringMaterials scienceNano-Composite materialElectronic packagingShear strength (soil)Die (integrated circuit)NanostructureNanotechnologyEnvironmental scienceSoil waterSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties