Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers
John H. Lau
Abstract
In this study, the recent advances and trends in multiple system and heterogeneous integration with through-silicon via (TSV)-less interposer (organic interposer or 2.3-D IC integration) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of multiple system and heterogeneous integration with TSV-less interposer. Also, some recommendations of 2.3-D IC integration will be provided.
Topics & Concepts
InterposerThrough-silicon viaSystem integrationComputer scienceThree-dimensional integrated circuitMaterials scienceSiliconElectronic engineeringSystems engineeringIntegrated circuitEngineeringNanotechnologyOperating systemOptoelectronicsEtching (microfabrication)Layer (electronics)3D IC and TSV technologiesNanofabrication and Lithography TechniquesElectronic Packaging and Soldering Technologies