Low-Temperature Diffusion Behavior of Ti in Cu/Ti-Ti/Cu Bonding
Seung-Min Park, Yoonho Kim, Sarah Eunkyung Kim
Topics & Concepts
Materials sciencePassivationDiffusionDiffusion bondingCopperSolderingTitaniumLayer (electronics)MetalActivation energyMetallurgyShear strength (soil)Chemical engineeringComposite materialPhysical chemistryChemistryThermodynamicsEngineeringEnvironmental scienceSoil waterSoil sciencePhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability