Study on thermal degradation mechanism of heat-resistant epoxy resin modified with carboranes
Meili Cui, Lili Zhang, Pingping Lou, Xuezhong Zhang, Xiaojie Han, Zhijie Zhang, Shuhua Zhu
Topics & Concepts
EpoxyCarboraneThermal stabilityCuring (chemistry)Materials scienceComposite materialAdhesiveDegradation (telecommunications)Thermal resistanceHeat resistanceThermalChemistryOrganic chemistryLayer (electronics)Computer scienceTelecommunicationsMeteorologyPhysicsBoron Compounds in ChemistryRadiopharmaceutical Chemistry and ApplicationsEpoxy Resin Curing Processes