Bridging a Cu layer enables decent metallurgical bonding for wire-arc directed energy deposited Mg-Ti bimetals
Qifei Han, Jiayuan Cui, Ming Fan, Yu Zheng, Shuijun Ye, Yueling Guo, Changmeng Liu, En-Hou Han
Topics & Concepts
BimetalIntermetallicMaterials scienceMetallurgyMicrostructureBimetallic stripIndentation hardnessTernary operationLayer (electronics)Exothermic reactionPhase (matter)Ultimate tensile strengthCopperResidual stressSolid solutionComposite materialNickelIsothermal processAdvanced Welding Techniques AnalysisMagnesium Alloys: Properties and ApplicationsAluminum Alloys Composites Properties