Epoxy molding compounds for high-performance electronic packaging: A review on recent studies
Lee Eyann, Muhamed Abdul Fatah Muhamed Mukhtar, Abdullah Aziz Saad, M. Mariatti
Topics & Concepts
Materials scienceEpoxyMolding (decorative)Electronic packagingComposite materialSynthesis and properties of polymersEpoxy Resin Curing Processes3D IC and TSV technologies