Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints
Qian Sun, Jie Wang, Xiaonan Wang, Xingwen Zhou, Xiaoxia Tang, Akira Kato, Akira Kato
Topics & Concepts
SolderingMaterials scienceMicrostructureIntermetallicScanning electron microscopeMetallurgySubstrate (aquarium)Energy-dispersive X-ray spectroscopyComposite materialAlloyOceanographyGeologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties