Thermodynamic modeling framework with experimental investigation of the large-scale bonded area and local void in Cu-Cu bonding interface for advanced semiconductor packaging
Sung-Hyun Oh, Hyun-Dong Lee, Hyun-Dong Lee, Jae-Uk Lee, Sung-Ho Park, Won-Seob Cho, Yong Jin Park, Alexandra Haag, Soichi Watanabe, Marco Arnold, Hoo-Jeong Lee, Hoo-Jeong Lee, Eun‐Ho Lee, Eun‐Ho Lee
Topics & Concepts
Materials scienceVoid (composites)SemiconductorInterface (matter)Composite materialScale (ratio)Engineering physicsOptoelectronicsEngineeringCapillary actionCapillary numberQuantum mechanicsPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability