Smoothing process of conformal vibration polishing for mid-spatial frequency errors: characteristics research and guiding prediction
Shiwei Liu, Hongxiang Wang, Qinghua Zhang, Jing Hou, Xianhua Chen, Qiao Xu, Chu Wang
Abstract
By combining the conformal polishing method with short stroke vibration, a novel, to the best of our knowledge, conformal vibration polishing (CVP) method is proposed. The CVP method is expected to be an efficient means of optical processing by its high material removal rate and smoothing characteristics of mid-spatial frequency (MSF) errors. A quantitative time-domain smoothing model and a convergence factor (${\rm CF}_C$) are presented based on the research of smoothing characteristics. The motion mechanism, material removal ability, solution, and expansion of the smoothing model are demonstrated theoretically and experimentally. The experimental results exhibited good agreement with the theoretical predictions for the proposed method. The research provides a certain theoretical foundation for parameter selection and process optimization of the CVP method.