Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface
Shuhui Chen, Lingyue Tan, Chenlin Yang, Peixin Chen, Anmin Hu, Huiqin Ling, Ming Li, Tao Hang
Topics & Concepts
Diffusion barrierMaterials scienceAmorphous solidBarrier layerIntermetallicNanoindentationDiffusionMetallurgyAlloyLayer (electronics)BrittlenessComposite materialCrystallographyThermodynamicsPhysicsChemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties