Direct-Writing Flexible Metal Circuit with Polymer/Metal Precursor Ink and Interfacial Reaction
Rui Sun, Mengdi Ma, Xiangcai Ma, Haiting Kang, Shuo Wang, Jiazhen Sun
Abstract
In this study, flexible metal circuits are fabricated with polymer/metal precursor ink and an interfacial reaction by direct-writing technology. Poly(vinyl alcohol) (PVA) is selected as one component of ink, which could be a flexible composite in a metal circuit and an adhesive layer to connect the flexible metal circuit with the flexible substrate. Silver nitrate (AgNO 3 ) is added to the ink as a source of metal. After the direct-writing structure was placed in contact with an ascorbic acid (VC) aqueous solution with an adjustable process, silver nanoparticles (AgNPs) with 100–400 nm uniform size could be generated on the direct-writing PVA skeleton. The resistivity of the composite silver layer could reach 10 –6 Ω·m without any postprocessing. Meanwhile, the resistance change could keep within 20% with 180° bending after 10 000 repeat times. Patterned flexible metal circuits could be facilely fabricated by direct-writing technology, which presented excellent electrical conductivity and flexibility.