Litcius/Paper detail

A meshless collocation scheme for inverse heat conduction problem in three-dimensional functionally graded materials

Wen Jun Hu, Yan Gu, Chia‐Ming Fan

2020Engineering Analysis with Boundary Elements20 citationsDOI

Topics & Concepts

Collocation (remote sensing)Cauchy distributionApplied mathematicsInverse problemTaylor seriesMathematicsInverseStability (learning theory)Convergence (economics)Regularized meshless methodBenchmark (surveying)Meshfree methodsThermal conductionMathematical analysisMathematical optimizationSingular boundary methodComputer scienceFinite element methodGeometryMaterials sciencePhysicsGeodesyEconomic growthEconomicsGeographyBoundary element methodThermodynamicsComposite materialMachine learningNumerical methods in engineeringComposite Material MechanicsElectromagnetic Scattering and Analysis