Low content and low-temperature cured silver nanoparticles/silver ion composite ink for flexible electronic applications with robust mechanical performance
Hao Jiang, Chengli Tang, Yan Wang, Linghang Mao, Quan Sun, Libing Zhang, Haijun Song, Fengli Huang, Chuncheng Zuo
Topics & Concepts
Materials scienceSilver nanoparticleComposite numberInkwellComposite materialCuring (chemistry)Electrical resistivity and conductivityElectrical conductorNanoparticleSubstrate (aquarium)Conductive inkIonSheet resistanceChemical engineeringNanotechnologyChemistryLayer (electronics)Electrical engineeringEngineeringOceanographyOrganic chemistryGeologyNanomaterials and Printing TechnologiesAdvanced Sensor and Energy Harvesting MaterialsConducting polymers and applications