Electrochemistry of copper post-CMP cleaning examined in combination with brush-scrubbing in a malonic acid solution
David R. Santefort, D. Roy
Topics & Concepts
Data scrubbingChemistryChemical-mechanical planarizationMalonic acidBrushElectrochemistryAdsorptionCopperWaferChemical modificationChemical engineeringNanotechnologyElectrodeOrganic chemistryPolymer chemistryLayer (electronics)Materials scienceComposite materialWaste managementPhysical chemistryEngineeringAdvanced Surface Polishing TechniquesCorrosion Behavior and InhibitionElectrodeposition and Electroless Coatings