Litcius/Paper detail

A zero-thermal-expansion composite with enhanced thermal and electrical conductivities resulting from 3D interpenetrating copper network

Buke Dong, Xinge Guo, Peng Tong, Lulu Xie, Keke Liu, Tingjiao Xiong, Xiaoguang Zhu, Jianchao Lin, Wenhai Song, Yuping Sun

2024Journal of Alloys and Compounds12 citationsDOI

Topics & Concepts

CopperComposite numberMaterials scienceThermal conductivityComposite materialThermal expansionElectrical resistivity and conductivityThermalElectrical conductorVolume (thermodynamics)MetallurgyThermodynamicsElectrical engineeringPhysicsEngineeringThermal Expansion and Ionic ConductivityThermal properties of materialsAdvanced Battery Materials and Technologies