Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system
Ke Lin, Huiqin Ling, Anmin Hu, Yunwen Wu, Liming Gao, Tao Hang, Ming Li
Topics & Concepts
Materials scienceSolderingIntermetallicScanning electron microscopePorosityChemical engineeringComposite materialMorphology (biology)TinMetallurgyAlloyEngineeringBiologyGeneticsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties