Simulation methodology development of warpage estimation for epoxy molding compound under considerations of stress relaxation characteristics and curing conditions applied in semiconductor packaging
Chang‐Chun Lee, Chang‐Chun Lee, Chia‐Chi Lee, Chia‐Chi Lee, Che-Pei Chang
Topics & Concepts
Materials scienceEpoxyShrinkageFinite element methodComposite materialMolding (decorative)ViscoelasticityCuring (chemistry)Stress relaxationStress (linguistics)Electronic packagingStructural engineeringCreepEngineeringPhilosophyLinguisticsElectronic Packaging and Soldering TechnologiesEpoxy Resin Curing Processes3D IC and TSV technologies